PACK FAIR – 2026 Shanghai International Packaging Exhibition 2027
PACK FAIR 2027 — the Shanghai International Packaging Exhibition — will be held from May 6 to 8, 2027 at the Shanghai World Expo Exhibition & Convention Center (SWEECC), 850 Bocheng Road, Pudong, Shanghai, China. Organized by Shanghai Hexin Exhibition Service Co., PACK FAIR is a professional trade show focused on the full packaging industry chain, covering packaging products, materials and related packaging machinery and equipment. The 2027 edition brings together 650 plus packaging brands and over 60,000 buyers from consumer goods, industrial manufacturing, processing, OEM/ODM and distribution channels. The 2026 edition was successfully concluded on June 2 to 4, 2026.
प्रवेश हेतु रजिस्ट्रेशन करें, या बूथों में भाग लें।
स्थल के नक्शा एवं आसपास के होटल
शांघाई – शांघाई वर्ल्ड एक्सपो एक्जिबिशन एंड कन्वेंशन सेंटर, शांघाई, चीन