PRINTED WIRING BOARDS EXPO 2027

PRINTED WIRING BOARDS EXPO Koto 2027
दिनांक: 17 फरवरी, 2027 से लेकर 19 फरवरी, 2027 तक
(कृपया, आयोजकों द्वारा दी गई तारीखों एवं स्थानों की जाँच कर लें।)

NEPCON JAPAN 2027 – the 41st Electronics R&D, Manufacturing and Packaging Technology Expo – runs from 17‑19 February 2027 at Tokyo Big Sight. It targets professionals across the electronics manufacturing spectrum, showcasing categories such as Home Appliances, Personal Computers, Office/Peripheral Equipment, Audio‑Visual, Test & Inspection, Aircraft/Vessel, Optical Instruments, Mobile Communication Systems, Semiconductor Assembly, Industrial Control & Factory Automation, Transportation, Medical Devices and more. The event runs alongside several concurrent specialized expos: INTERNEPCON JAPAN, ELECTROTEST JAPAN, IC SENSOR PACKAGING EXPO, ELECTRONIC COMPONENTS MATERIALS EXPO, PWB EXPO, FINE PROCESS TECHNOLOGY EXPO, Power Device & Module Expo, and EMS & ODM EXPO, providing a comprehensive platform for the entire electronics supply chain.


प्रवेश हेतु रजिस्ट्रेशन करें, या बूथों में भाग लें।

Please register at the organizer website of PRINTED WIRING BOARDS EXPO

स्थल के नक्शा एवं आसपास के होटल

कोटो – टोक्यो बिग साइट, टोक्यो, जापान